半導體加工中的材料科學 SCIE

期刊簡介預計審稿時間： 約1.7個月 約3.7周

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

《半導體加工中的材料科學》為討論（光）電子、傳感器、探測器、生物技術和綠色能源的功能材料和器件的新型加工、應用和理論研究提供了一個獨特的論壇。

每期都旨在提供當前見解、新成就、突破和未來趨勢的快照，涉及微電子、能量轉換和存儲、通信、生物技術、（光）催化、納米和薄膜技術、混合和復合材料、化學加工、氣相沉積、器件制造和建模等不同領域，這些領域是先進半導體加工和應用的支柱。

內容包括：亞微米器件的先進光刻技術；蝕刻及相關主題；離子注入；損傷演變和相關問題；等離子體和熱 CVD；快速熱處理；先進的金屬化和互連方案；薄介電層、氧化；溶膠-凝膠處理；化學浴和（電）化學沉積；復合半導體加工；新型非氧化物材料及其應用； (大)分子和混合材料；分子動力學、從頭算方法、蒙特卡羅等；分立電路和集成電路的新材料和新工藝；磁性材料和自旋電子學；異質結構和量子器件；半導體電學和光學特性的工程；晶體生長機制；可靠性、缺陷密度、固有雜質和缺陷。

《Materials Science In Semiconductor Processing》(半導體加工中的材料科學)編輯部通訊方式為ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB。如果您需要協助投稿或潤稿服務，您可以咨詢我們的客服老師。我們專注于期刊咨詢服務十年，熟悉發表政策，可為您提供一對一投稿指導，避免您在投稿時頻繁碰壁，節省您的寶貴時間，有效提升發表機率，確保SCI檢索（檢索不了全額退款）。我們視信譽為生命，多方面確保文章安全保密，在任何情況下都不會泄露您的個人信息或稿件內容。